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  • STM32F103C8T6
  • MFI343S00177
  • STM32F407VET6
  • ATMEGA328P-PU
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Items : %s%s

IC Adapters

Additional Feature

  • ADAPTER
  • SOCKET ADAPTER
  • SOCKET ADAPTER, 94V-0
  • SOCKET ADAPTER, UL 94V-0
  • STANDARD: UL 94V-0
  • UL 94V-0

Board Material

  • FR4 Epoxy Glass
  • Polyimide (PI)

Body Breadth

  • 0.7 inch

Body Depth

  • 0.3 inch

Body Material

  • Glass, Polysulfone

Cable Length

  • 3m

Connector Type

  • DIP, Socket

Contact Finish - Mating

  • GOLD
  • GOLD (10)
  • GOLD (10) OVER NICKEL (100)
  • NOT SPECIFIED
  • Silver
  • TIN
  • TIN LEAD
  • Tin-Lead

Contact Finish - Post

  • Gold
  • Tin
  • Tin-Lead

Contact Finish Thickness - Post

  • Flash

Contact Material

  • Brass
  • Copper

Contact Material - Mating

  • Beryllium Copper
  • Brass
  • Copper
  • Phosphor Bronze

Contact Material - Post

  • Beryllium Copper
  • Brass
  • Brass Alloy
  • Phosphor Bronze

Contact Plating

  • Gold
  • Gold, Tin
  • Lead, Tin
  • Silver
  • Tin

Contact Style

  • RND PIN-SKT

Convert From (Adapter End)

  • AT90PWM1
  • AT90PWM2
  • DIP, 0.3 (7.62mm) Row Spacing
  • DIP, 0.4 (10.16mm) Row Spacing
  • DIP, 0.6 (15.24mm) Row Spacing
  • DIP, 0.8 (20.32mm) Row Spacing
  • DIP, 0.9 (22.86mm) Row Spacing
  • DIP, 1.0 (25.40mm) Row Spacing
  • HB2E Relay
  • MSOP
  • Multiple Packages
  • PLCC
  • PQFP
  • QFP
  • SIP
  • Socket, 0.6 (15.24mm) Row Spacing
  • SOIC
  • SOIC-W
  • SOJ
  • SSOP
  • TQFP
  • TSOP
  • VQFP

Convert To (Adapter End)

  • DIP
  • DIP, 0.3 (7.62mm) Row Spacing
  • DIP, 0.4 (10.16mm) Row Spacing
  • DIP, 0.6 (15.24mm) Row Spacing
  • DIP, 0.8 (20.32mm) Row Spacing
  • DIP, 0.9 (22.86mm) Row Spacing
  • DIP, 1.0 (25.40mm) Row Spacing
  • JEDEC
  • PGA
  • PLCC
  • QFP
  • SOIC
  • SOWIC

Core Architecture

  • AVR

Current Rating

  • 1A
  • 3A

Current Rating (Amps)

  • 1A
  • 3A

Depth

  • 25.4mm
  • 32.3mm
  • 32mm
  • 43.2mm
  • 6.9mm

Device Socket Type

  • IC SOCKET

ECCN Code

  • EAR99

Factory Lead Time

  • 16 Weeks
  • 4 Weeks
  • 5 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks
  • 9 Weeks

Feature

  • Closed Frame
  • High Temperature
  • Socket Included

Flammability Rating

  • UL94 V-0

Gender

  • Female

Height

  • 1.58mm
  • 2.29mm
  • 2.39mm
  • 5.85mm
  • 6.08mm
  • 6.9mm

Housing Material

  • Polyamide
  • Polyamide (PA46), Nylon 4/6, Glass Filled
  • Polyester
  • Polyphenylene Sulfide (PPS)
  • Polysulfone (PSU), Glass Filled
  • RYTON

Insulation Resistance

  • 1GOhm

JESD-609 Code

  • e0
  • e3
  • e4

Lead Free

  • Contains Lead
  • Lead Free

Lead Length

  • 2.032mm
  • 2.286mm
  • 3.175mm
  • 3.302mm
  • 3.683mm
  • 3.81mm
  • 3m
  • 5.9944mm

Lead Pitch

  • 1.27mm
  • 2.54mm

Length

  • 10.2mm
  • 100.3mm
  • 17.8mm
  • 19.4mm
  • 20.3mm
  • 22.2mm
  • 22.9mm
  • 25.4mm
  • 30.5mm
  • 34.3mm
  • 35.6mm
  • 39.4mm
  • 3m
  • 40.1mm
  • 40.5mm
  • 40.6mm
  • 43.2mm
  • 45mm
  • 50.3mm
  • 55.2mm
  • 65.5mm
  • 68.1mm
  • 69.9mm
  • 72.5mm
  • 95.7mm

Material

  • Glass, Polyester, Thermoplastic
  • Polyester

Material Flammability Rating

  • UL94 V-0

Moisture Sensitivity Level (MSL)

  • 1 (Unlimited)
  • Not Applicable

Mount

  • Socket
  • Surface Mount
  • Through Hole
  • Through Hole, Wire
  • Wire

Mounting Type

  • Surface Mount
  • Through Hole

Number of Contacts

  • 10
  • 100
  • 12
  • 128
  • 132
  • 14
  • 144
  • 16
  • 160
  • 18
  • 20
  • 200
  • 208
  • 22
  • 24
  • 28
  • 32
  • 36
  • 40
  • 42
  • 44
  • 48
  • 52
  • 56
  • 64
  • 68
  • 8
  • 80
  • 84
  • 90

Number of Pins

  • 10
  • 100
  • 12
  • 128
  • 132
  • 14
  • 144
  • 16
  • 160
  • 169
  • 18
  • 184
  • 20
  • 208
  • 22
  • 24
  • 26
  • 28
  • 32
  • 36
  • 40
  • 42
  • 44
  • 48
  • 52
  • 56
  • 60
  • 64
  • 68
  • 8
  • 80
  • 84
  • 90

Number of Positions

  • 10
  • 12
  • 14
  • 144
  • 16
  • 160
  • 18
  • 20
  • 22
  • 24
  • 26
  • 28
  • 32
  • 40
  • 42
  • 48
  • 56
  • 64
  • 90
  • 95

Number of Rows

  • 1
  • 2

Orientation

  • Straight

Package / Case

  • PLCC
  • QFP
  • SOIC
  • TO-8
  • TSOP

Packaging

  • Box
  • Bulk

Part Status

  • Active
  • Obsolete

Pbfree Code

  • no
  • yes

PCB Contact Pattern

  • RECTANGULAR

PCB Contact Row Spacing

  • 0.3 mm
  • 0.6 mm

Pitch

  • 1.778mm
  • 1.78mm
  • 2.54mm

Pitch - Mating

  • 0.020 0.50mm
  • 0.024 0.60mm
  • 0.025 0.64mm
  • 0.026 0.65mm
  • 0.031 0.80mm
  • 0.050 1.27mm
  • 0.070 1.78mm
  • 0.100 2.54mm

Pitch - Post

  • 0.031 0.80mm
  • 0.050 1.27mm
  • 0.070 1.78mm
  • 0.100 2.54mm

Published

  • 2000
  • 2001
  • 2002
  • 2003
  • 2005
  • 2006
  • 2007
  • 2008
  • 2009
  • 2010
  • 2011
  • 2012
  • 2013
  • 2017
  • 2018

Radiation Hardening

  • No

REACH SVHC

  • No SVHC

RoHS Status

  • Non-RoHS Compliant
  • RoHS Compliant
  • ROHS3 Compliant

Row Spacing

  • 10.16 mm
  • 15.24 mm
  • 2.54 mm
  • 20.32 mm
  • 22.86 mm
  • 25.4 mm
  • 3.81 mm
  • 7.62 mm

Sensing Distance

  • 3 m

Series

  • 647
  • DS9075

Termination

  • Solder
  • Wire Wrap

Termination Post Length

  • 0.030 0.76mm
  • 0.031 0.80mm
  • 0.080 2.03mm
  • 0.089 2.28mm
  • 0.090 2.29mm
  • 0.125 3.18mm
  • 0.130 3.30mm
  • 0.145 3.68mm
  • 0.150 3.81mm
  • 0.180 4.57mm
  • 0.236 6.00mm
  • 0.620 15.75mm

Voltage - Rated

  • 1kV

Weight

  • 453.59237g
  • 680.388555g

Width

  • 24.4mm
  • 27.9mm
  • 32.3mm
  • 32mm
  • 38.5mm
  • 43.2mm
  • 6.9mm
Reset
Apply
    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Material Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Number of Pins Additional Feature Package / Case REACH SVHC Lead Pitch Height Mounting Type Weight Operating Temperature Insulation Resistance Lead Length JESD-609 Code Body Breadth Number of Rows PCB Contact Pattern Body Depth Contact Style Feature Pitch Current Rating (Amps) PCB Contact Row Spacing Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material
    20-354000-10 20-354000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 Gold 20 Non-RoHS Compliant UL94 V-0 Tin 3A 20 STANDARD: UL 94V-0 Surface Mount 105°C e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
    24-354000-20 24-354000-20 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 24 ROHS3 Compliant UL94 V-0 Gold, Tin 3A 24 STANDARD: UL 94V-0 Surface Mount e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
    28-650000-10-P 28-650000-10-P Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2010 Correct-A-Chip® 650000 Active 1 (Unlimited) Solder 28 35.6mm Non-RoHS Compliant 28 SOIC 1.58mm Through Hole 0.050 1.27mm Tin-Lead Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    32-652000-10-P 32-652000-10-P Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 652000 Active 1 (Unlimited) Solder Non-RoHS Compliant Lead Free 1A 32 PLCC Through Hole 3.175mm 1A 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    1107254-16 1107254-16 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 Correct-A-Chip® 1107254 yes Active 1 (Unlimited) Solder EAR99 Gold 16 ROHS3 Compliant UL94 V-0 3A 16 SOCKET ADAPTER 2.54mm Through Hole 3.302mm e3 0.7 inch 2 RECTANGULAR 0.3 inch RND PIN-SKT 0.3 mm UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
    44-652000-11-RC 44-652000-11-RC Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 652000 yes Active 1 (Unlimited) Solder EAR99 44 ROHS3 Compliant 1A 44 UL 94V-0 Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    32-652000-10 32-652000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2007 Correct-A-Chip® 652000 Active 1 (Unlimited) Solder EAR99 32 40.6mm Non-RoHS Compliant 32 UL 94V-0 1.58mm Through Hole e0 1A IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    14-35W000-10 14-35W000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2003 Correct-A-Chip® 35W000 Active 1 (Unlimited) Solder EAR99 NOT SPECIFIED 14 17.8mm Non-RoHS Compliant Lead Free 14 SOIC 1.58mm Through Hole IC SOCKET 0.050 1.27mm Tin-Lead Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
    14-354000-11-RC 14-354000-11-RC Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount Polyester Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 14 ROHS3 Compliant UL94 V-0 Copper 3A 14 STANDARD: UL 94V-0 No SVHC Surface Mount 762μm e4 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.030 0.76mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
    1109252 1109252 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks Through Hole 2006 Correct-A-Chip® 1109252 Active 1 (Unlimited) Solder 56 EAR99 56 Non-RoHS Compliant 28 Through Hole 3.175mm e3 IC SOCKET Tin-Lead Brass 0.125 3.18mm 0.070 1.78mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    28-652000-11-RC 28-652000-11-RC Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 652000 yes Active 1 (Unlimited) Solder EAR99 28 ROHS3 Compliant Lead Free 1A 28 UL 94V-0 Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    LCQT-QFP0.5-40 LCQT-QFP0.5-40 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole Polyester Correct-A-Chip® Active 1 (Unlimited) Solder 125°C -55°C Non-RoHS Compliant UL94 V-0 Lead Free 40 QFP No SVHC Through Hole -55°C~125°C 5.9944mm UL94 V-0 0.020 0.50mm Gold Flash Brass 0.236 6.00mm 0.100 2.54mm Multiple Packages QFP FR4 Epoxy Glass
    1106396-14 1106396-14 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1106396 yes Active 1 (Unlimited) Solder EAR99 Gold 14 ROHS3 Compliant UL94 V-0 3A 14 SOCKET ADAPTER 2.54mm Through Hole 3.302mm e3 2 RECTANGULAR RND PIN-SKT 0.6 mm UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
    96-128M80 96-128M80 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 Correct-A-Chip® Obsolete 1 (Unlimited) Solder EAR99 Tin 128 Non-RoHS Compliant 128 SOCKET ADAPTER Through Hole 105°C IC SOCKET 0.031 0.80mm Tin-Lead 200.0μin 5.08μm Copper Brass Alloy 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
    1107254-20 1107254-20 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1107254 yes Active 1 (Unlimited) Solder EAR99 Gold 20 ROHS3 Compliant UL94 V-0 3A 20 SOCKET ADAPTER 2.54mm Through Hole 3.302mm e3 0.7 inch 2 RECTANGULAR 0.3 inch RND PIN-SKT 0.3 mm UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
    1107254-24 1107254-24 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 Correct-A-Chip® 1107254 yes Active 1 (Unlimited) Solder 24 EAR99 Gold 24 30.5mm ROHS3 Compliant Lead Free Copper SOCKET ADAPTER No SVHC 2.54mm 2.29mm Through Hole e3 0.7 inch 2 RECTANGULAR 0.3 inch RND PIN-SKT 3A UL94 V-0 15.24 mm IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
    264-1300-29-0602J 264-1300-29-0602J Artery 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 64 150°C -55°C Female Gold 64 72.5mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 64 6.9mm Through Hole -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.070 1.78mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.070 1.78mm DIP, 0.8 (20.32mm) Row Spacing DIP, 0.8 (20.32mm) Row Spacing
    232-1285-19-0602J 232-1285-19-0602J Artery 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 32 150°C -55°C Female Gold 32 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 32 Through Hole 453.59237g -55°C~125°C 1GOhm Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
    24-351000-10 24-351000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2009 Correct-A-Chip® 351000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 24 Non-RoHS Compliant Lead Free Tin 1A 24 SOCKET ADAPTER 1.58mm Through Hole e0 2 7.62 mm IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SSOP DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
    12-665000-00 12-665000-00 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 665000 Active 1 (Unlimited) Solder 12 Non-RoHS Compliant 12 SOIC Surface Mount 787.4μm 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.031 0.80mm 0.050 1.27mm SOIC-W SOIC FR4 Epoxy Glass
    228-1290-29-0602J 228-1290-29-0602J Artery 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2000 Textool™ Active 1 (Unlimited) Solder 28 150°C -55°C Female Gold 28 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 28 Through Hole 453.59237g -55°C~125°C 2.54mm 1A UL94 V-0 0.070 1.78mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.070 1.78mm DIP, 0.4 (10.16mm) Row Spacing DIP, 0.4 (10.16mm) Row Spacing
    16-354000-21-RC 16-354000-21-RC Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 16 ROHS3 Compliant UL94 V-0 3A 16 STANDARD: UL 94V-0 Surface Mount 2.286mm e4 UL94 V-0 IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.089 2.28mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
    22-665000-00 22-665000-00 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2006 Correct-A-Chip® 665000 Active 1 (Unlimited) Solder EAR99 22 Non-RoHS Compliant 22 Surface Mount e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.031 0.80mm 0.050 1.27mm SOIC-W SOIC FR4 Epoxy Glass
    242-1293-29-0602J 242-1293-29-0602J Artery 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 9 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 42 150°C -55°C Female Gold 42 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 42 Through Hole -55°C~125°C Closed Frame 1.778mm 1A UL94 V-0 0.070 1.78mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.070 1.78mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
    08-666000-00 08-666000-00 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 666000 Active 1 (Unlimited) Solder EAR99 8 Non-RoHS Compliant 8 UL 94V-0 Surface Mount 2.032mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.080 2.03mm 0.050 1.27mm SOIC SOWIC FR4 Epoxy Glass
    20-665000-00 20-665000-00 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 665000 Active 1 (Unlimited) Solder EAR99 20 Non-RoHS Compliant 20 Surface Mount 787.4μm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.031 0.80mm 0.050 1.27mm SOIC-W SOIC FR4 Epoxy Glass
    32-450001-11-RC 32-450001-11-RC Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2007 Correct-A-Chip® 450001 yes Active 1 (Unlimited) Solder EAR99 Gold 32 40.6mm ROHS3 Compliant Lead Free 32 SOCKET ADAPTER 1.58mm Through Hole e4 IC SOCKET 0.050 1.27mm 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOJ DIP, 0.4 (10.16mm) Row Spacing FR4 Epoxy Glass
    20-350001-11-RC 20-350001-11-RC Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2007 Correct-A-Chip® 350000 yes Active 1 (Unlimited) Solder EAR99 GOLD (10) OVER NICKEL (100) 20 25.4mm ROHS3 Compliant Lead Free 20 SOCKET ADAPTER SOIC 1.58mm Through Hole e4 IC SOCKET 0.050 1.27mm Tin 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOJ DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
    12-666000-00 12-666000-00 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 666000 Active 1 (Unlimited) Solder EAR99 12 Non-RoHS Compliant 12 UL 94V-0 Surface Mount 2.032mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.080 2.03mm 0.050 1.27mm SOIC SOWIC FR4 Epoxy Glass
    242-1281-19-0602J 242-1281-19-0602J Artery 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Obsolete 1 (Unlimited) Wire Wrap 42 150°C -55°C Gold 42 68.1mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 42 6.9mm Through Hole 453.59237g -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
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